nichia sts-da1-2104 nichia corporation specifications for white led NSPW570GS-K1 rohs compliant
nichia sts-da1-2104 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 30 ma pulse forward current i fp 100 ma reverse voltage v r 5 v power dissipation p d 105 mw operating temperature t opr -30~85 c storage temperature t stg -40~100 c junction temperature t j 100 c * absolute maximum ratings at t a =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ unit forward voltage v f i f =20ma 3.1 v luminous intensity i v i f =20ma 1.9 cd x - i f =20ma 0.31 - chromaticity coordinate y - i f =20ma 0.32 - * characteristics at t a =25c. * luminous intensity value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart.
nichia sts-da1-2104 2 ranks item rank min max unit forward voltage - 2.7 3.5 v reverse current - - 50 a w 1.75 2.53 v 1.24 1.75 luminous intensity u 0.88 1.24 cd color ranks rank a0 rank b1 x 0.280 0.264 0.283 0.296 x 0.287 0.283 0.330 0.330 y 0.248 0.267 0.305 0.276 y 0.295 0.305 0.360 0.339 rank b2 rank c0 x 0.296 0.287 0.330 0.330 x 0.330 0.330 0.361 0.356 y 0.276 0.295 0.339 0.318 y 0.318 0.360 0.385 0.351 * ranking at t a =25c. * reverse current at v r =5v. * tolerance of measurements of the forward voltage is 3%. * tolerance of measurements of the luminous intensity is 10%. * tolerance of measurements of the chromaticity coordinate is 0.01. * a shipment shall consist of leds in a combination of the above ranks. the percentage of each rank in the shipment shall be determined by nichia.
nichia sts-da1-2104 3 chromaticity diagram a0 b1 b2 c0 0.20 0.25 0.30 0.35 0.40 0.45 0.20 0.25 0.30 0.35 0.40 0.45 x y
nichia sts-da1-2104 4 outline dimensions sts-da7-1978 NSPW570GS-K1 ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m??? * ( g unit: mm, tolerance: 0.2) ???`? lead standoff 1 0.3 0.3 ? led ???? ??`?? ? ?? ?QH???? `???~? ??? * the tie bar cut-end surface exhibits exposed copper alloy base metal. care must be taken to handle the leds, as it may contain sharp parts such as lead, and can cause injury. ? item ?| resin materials `??`| lead frame materials | weight description ?? ( ?w ) epoxy resin(partly using phosphor) ~? + y? ag-plated copper alloy 0.23g(typ) 5.6 1 (2) (2.5) 1.1 1.5 max. 5.5 4.5 9.30.5 25.81 5.3 5 anode cathode 0.5 0.05
nichia sts-da1-2104 5 soldering ? recommended hand soldering condition temperature 350c max soldering time 3sec max position no closer than 3mm from the base of the lens. ? recommended dip soldering condition pre-heat 120c max pre-heat time 60sec max solder bath temperature 260c max dipping time 10sec max dipping position no closer than 3mm from the base of the lens. * for a better thermal performance, copper alloy is used for the leadframe of the product. care must be taken for the soldering conditions and handling of the products after soldering. * solder the led no closer than 3mm from the base of the lens. soldering beyond the base of the tie bar is recommended. * dip soldering/hand soldering must not be performed more than once. * care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly. * when soldering, do not apply stress to the lead frame while the led is hot. * after soldering, the led position must not be corrected. * after soldering, no mechanical shock or vibration should be applied to led lens until the leds cool down to room temperature. * in order to avoid damage on the lens during cutting and clinching the leads, it is not recommended to solder the leds directly on customer pcb without any gap between the lens and the board. if it is unavoidable, customer is advised to check whether such soldering will not cause wire breakage or lens damage. direct soldering to double-sided pcbs must be av oided due to an increased effect of heat on the lens. * when it is necessary to clamp the leds to prevent soldering failure, it is important to minimize the mechanical stress on the leds. * cut the led lead frames at room temperature. cutting the le ad frames at high temperature may cause failure of the leds.
nichia sts-da1-2104 6 packaging - bulk ? label attached to the box ? label printed on the bag sts-da7-0001b nxxxxxxx ? for details, see "lot numbering scheme" in this document. * ??????????? if not provided, it is not indicated on the label. ******* is the customer part number. O??????? * ******* ? ?? ? no. rohs nxxxxxxx xxxx led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs nxxxxxxx ******* xxxx led caution to electrostatic damage ??? nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty pcs ymxxxx-rrr anti-electrostatic bag ?? nichia led anti-electrostatic bags are packed in cardboard boxes with corrugated partitions. ??K? ?`? products are packed in an anti-electrostatic bag. they are shipped in cardboard boxes to protect th em from external forces during transportation. ?`?????? y?????? * ? \H?y?B???y? * ?QH n???? u?p?????? * * u????? ??n?go??`y? do not expose to water, the box is not water-resistant. using an original packaging material or equivalent in transit is recommended. do not drop or shock the box. it may damage the products.
nichia sts-da1-2104 7 lot numbering scheme lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by color coordinates, ranking by luminous intensity
nichia sts-da1-2104 8 derating characteristics nspw570g(s)-k1 sts-da7-1959 ? no. derating1 0 10 20 30 40 50 0 20406080100120 (47, 30.0) (85, 8.50) dut y 10 100 1000 1 10 100 30 S a ll owa bl e forwar d c urr ent ( ma ) ??-S ambient temperature vs allowable forward current S allowable forward current(ma) ?? ambient temperature(c) ?` ?` duty ratio(%) ?`?`-S duty ratio vs allowable forward current t a = 25c
nichia sts-da1-2104 9 optical characteristics nspw570g(s)-k1 ? no. sts-da7-19 60 spectrum 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 relative luminosity(a.u.) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -2 0 -30 -4 0 -50 -60 -70 -80 -9 0 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 10.500.51 20ma i f = t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. 20ma i fp = t a =25c
nichia sts-da1-2104 10 forward current characteristics / temperature characteristics nspw570g(s)-k1 sts-da7-1961 ? no. tavf 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -60 -40 -20 0 20 40 60 80 100 120 ta iv 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 vfif 1 10 100 2.02.53.03.54.04.55.0 20 relative lumin osity(a.u .) ??- ambient temperature vs relative luminosity forward current(ma) ifiv 0 1 2 3 4 5 0 20406080100120 relative luminosity(a.u.) - forward current vs relative luminosity forward current(ma) ?R- forward voltage vs forward current ??-?R ambient temperature vs forward voltage ?R forward volta g e ( v ) ?R forward voltage(v) ?? ambient temperature( c) ?? ambi ent t em p erature ( c ) t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25c i fp = 20ma i fp = 20ma i fp = 60ma i fp = 5ma
nichia sts-da1-2104 11 forward current characteristics / temperature characteristics ? no. nspw570g(s)-k1 sts-da7-1962 taxy 0.30 0.31 0.32 0.33 0.34 0.29 0.30 0.31 0.32 0.33 -30c 0c 25 c 50c 85 c x ifxy 0.30 0.31 0.32 0.33 0.34 0.29 0.30 0.31 0.32 0.33 1m a 5ma 20m a 30ma 100ma x y y 20ma i fp = ??-? ambient temperature vs chromaticity coordinate -? forward current vs chromaticity coordinate t a =25c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts-da1-2104 12 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat jeita ed-4701 300 302 t sld =2605c, 10sec, 1dip, 3mm from the base of the lens #1 0/50 solderability jeita ed-4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #2 0/50 temperature cycle jeita ed-4701 100 105 -40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/50 moisture resistance (cyclic) jeita ed-4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/50 terminal bend strength jeita ed-4701 400 401 5n, 0~90~0bend, 2bending cycles #1 0/50 terminal pull strength jeita ed-4701 400 401 10n, 101sec #1 0/50 high temperature storage jeita ed-4701 200 201 t a =100c 1000hours #1 0/50 temperature humidity storage jeita ed-4701 100 103 t a =60c, rh=90% 1000hours #1 0/50 low temperature storage jeita ed-4701 200 202 t a =-40c 1000hours #1 0/50 room temperature operating life t a =25 , i f =30ma 500hours #1 0/50 temperature humidity operating life 60c, rh=90%, i f =20ma 500hours #1 0/50 low temperature operating life t a =-30c, i f =20ma 500hours #1 0/50 notes: measurements are performed after allowing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage(v f ) i f =20ma >u.s.l.1.1 luminous intensity(i v ) i f =20ma u.s.l.2.0 #2 solderability - less than 95% solder coverage u.s.l. : upper specification limit l.s.l. : lower specification limit
nichia sts-da1-2104 13 cautions (1) lead forming when forming leads, the leads shou ld be bent at a point at lease 3 mm from the base of the epoxy bulb. do not use the base of the leadfr ame as a fulcrum during lead forming. lead forming should be done before soldering. do not apply any bending stress to the base of the lead. the stress to the base may damage the led's characteristics or it may break the leds. when mounting the product onto a printed circuit board, the via-holes on the board should be exactly aligned with the lead pitch of the product. if the leds are mounted with stress at the leads, it causes deterioration of the epoxy r esin and this will degrade the leds. (2) storage shelf life of the products in unopened bag is 3 mont hs(max.) at <30c and 70% rh from the delivery date. if the shelf life exceeds 3 months or more, th e leds need to be stored in a sealed container with silica gel desiccants to ensure their shelf life will not exceed 1 year. nichia led leadframe are silver plated copper alloy. this silver surface may be affected by environments which contain corrosive substances. please avoid conditio ns which may cause the led to corrode, tarnish or discolor. this corrosion or discoloration may cause difficulty during soldering operation. it is recommended that the le ds be used as soon as possible. to avoid condensation, the pr oducts must not be stored in the areas where temperature and humidity fluctuate greatly. (3) directions for use when designing a circuit, the current through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended . if the leds are operated with constant voltage using circui t a, the current through the leds may vary due to the variation in forward voltage characteristics of the leds. (a) ... (b) ... leds should be operated in forward bias. driving circuits must not subject leds to either forw ard or reverse voltage while off . continuous reverse voltage can cause migration and led damage. for stabilizing the led characteristics, it is recomm ended to operate at greater than 10% nominal current. care must be taken to ensure that the reverse vo ltage will not exceed the absolute maximum rating when using the leds with matrix drive. for outdoor use, necessary measures should be take n to prevent water, moisture and salt air damage. (4) handling precautions do not handle leds with bare hands, it may contamin ate the led surface and affect optical characteristics. in the worst case, catastrophic failure from excess pres sure through wire-bond breaks and package damage may result. dropping the product may cause damage. do not stack assembled pcbs together. fa ilure to comply can cause the resin portio n of the product to be cut, chipped, delaminated and/or deformed. it may cause wi re to break, leading to catastrophic failures. (5) design consideration pcb warpage after mounting the products onto a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechan ical stress is exerted on the le ds placed near the score lines. the led should be placed in a way to minimi ze the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands.
nichia sts-da1-2104 14 (6) electrostatic discharge (esd) the products are sensitive to static electricity or su rge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wriststrap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials proper grounding is required for all devices, eq uipment, and machinery used in product assembly. surge protection should be considered when designing of commercial products. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electros tatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is advised to chec k if the leds are damaged by esd when performing the characteristics insp ection of the leds in the application. damage can be detected with a forward voltag e measurement or a light-up test at low current ( 1ma). esd damaged leds may have an increased leakage current, current flow at a low voltage or no longer illuminate at a low current . failure criteria: v f <2.0v at i f =0.5ma (7) thermal management proper thermal management is an important when designin g products with leds. led di e temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a wa y that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. (8) cleaning if required, isopropyl alcohol (ipa) should be used. ot her solvents may cause premature failure to the leds due to the damage to the resin po rtion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. ultrasonic cleaning is not recommended sinc e it may have adverse effects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advise d to make sure the leds will not be damaged prior to cleaning. (9) eye safety in 2006, the international electrical commission (iec ) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825-1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions have adopted standards based on the iec laser safety standard iec 60825- 1:20112001, which still includes leds in its scope. most of nichia's leds can be classified as belo nging into either the exempt group or risk group 1. high-power leds, that emit light containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation.
nichia sts-da1-2104 15 (10) others the leds described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuclear reactor co ntrol system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia di rectly before disassembling or analysis. both the customers and nichia will agree on official specificat ions of supplied products before a customer's volume production . specifications and appearance subject to change for improvement without notice.
|
